1 / 4 www. asb.co.kr november 2008 p lerow tm aln0460wt internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in c ase allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 450 470 gain db 21 22 gain flatness db ? 0.1 ? 0.2 noise figure db 0.75 0.8 output ip3 (1) dbm 34 35 s11 / s22 (2) db - 17 / - 14 output p1db dbm 20 21 switching time ? sec - supply current ma 65 75 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 8 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground feature s s 21 = 22.1 db @ 450 mhz = 21.9 db @ 470 mhz nf of 0.75 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes b e placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln0460wt asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 460 mhz, z o.sys =50 ohm ou t line drawi ng (unit: mm) solder stencil area specifications (in pr o duction)
2 / 4 www. asb.co.kr november 2008 p lerow tm aln0460wt internally matched lna module s - param e ters noise figure oip3 p1db 450~470 mhz +5 v typical performance (measured) s - par ameters & k fa c tor
3 / 4 www. asb.co.kr november 2008 p lerow tm aln0460wt internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) curren t (ma) 4.5 - 17.19 - 15.95 22.14 0.25 0.723 20.41 32.78 47 4.6 - 17.55 - 16.20 22.19 0.25 0.728 20.77 33.52 51 4.7 - 17.96 - 16.40 22.21 0.25 0.733 21.09 34.02 55 4.8 - 18.25 - 16.58 22.30 0.25 0.735 21.36 34.44 59 4.9 - 18.57 - 16.62 22.34 0.25 0.736 21.61 35. 00. 63 5.0 - 18.78 - 16.70 22.38 0.25 0.737 21.86 35.31 67 5.1 - 19.04 - 16.76 22.41 0.25 0.741 22.05 35.61 71 5.2 - 19.22 - 16.77 22.43 0.25 0.757 22.27 35.74 74 5.3 - 19.38 - 16.75 22.47 0.25 0.767 22.47 36.02 78 5.4 - 19.41 - 16.72 22.49 0.25 0.771 22.64 36. 11 82 5.5 - 19.54 - 16.64 22.52 0.25 0.782 22.83 36.16 85 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 22.5 - 19.35 22.35 0.25 0.565 22.32 35.00 63 - 20 ? c - 21.5 - 18.45 22.31 0.25 0.617 22.19 35.03 64 0 ? c - 20.3 - 17.6 22.30 0.25 0.670 22.05 35.14 65 25 ? c - 19.07 - 16.80 22.28 0.25 0.739 21.92 35.35 66 40 ? c - 18.34 - 16.30 22.29 0.25 0.763 21.63 35.14 67 60 ? c - 17.47 - 15.63 22.24 0.25 0.835 21.33 34.91 67 80 ? c - 16.59 - 14.88 22.17 0.25 0.884 20.83 34.5 1 66 100 ? c - 15.84 - 14.22 22.08 0.25 0.949 20.22 34.19 64 rf performance with voltage change rf performance with operating temperature
4 / 4 www. asb.co.kr november 2008 p lerow tm aln0460wt internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc suppl y status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. theref ore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. preliminary application circuit reco mmended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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